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By using an image imaging system and a light source perpendicular to the tested board from the top surface, the image is presented (captured by the camera in real-time) and sensed. The image is then transmitted to a computer measurement software, where it is analyzed by the software's measurement tools for standard tolerance value comparisons of features such as "line width/line spacing/upper and lower amplitudes of line width/circles/gold finger line width," among others. This allows for the determination of the measured values on the tested board.
The inspection process involves measuring the upper and lower widths of the lines, the distances between lines, the diameters of circular holes, the distances between hole centers, and the distances from holes to edge lines on the inner and outer layers of printed circuit boards after developing and etching (before applying green oil). Additionally, it can be extended to applications such as measuring line width and spacing on IC chips, film width measurements, and microscopic distance measurements for LCD circuit boards.
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