The optical measuring instrument for precision inspection is primarily used to measure the upper and lower widths of circuits, line spacing, hole diameters, pads, and other dimensions on inner and outer layers of printed circuit boards with varying thicknesses after development and etching (before applying green oil).
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It can fulfill the requirements of fast and accurate 3D image stitching observation and precise measurement. Primarily used in the PCB industry for measuring the depth, diameter, and offset of automatic multi-point blind holes or back drills, it enables batch measurement of multiple holes through fully automated processes.
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The fully automatic glass clamping plate design effectively reduces Abbe errors caused by factors such as warping of the tested product, meeting the needs of various size measurements and quality analysis in the market.
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GXF_L6850 stands for Global Xtreme Future, symbolizing innovation and forward-thinking. It is designed for automatic spacing adjustment and measurement of PCB products such as AI servers and optical modules, with a maximum bandwidth support of 67GHz;
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Perform temperature cycling and flow soldering simulation robustness tests on PCBs within the temperature range of -65 ° -265 ° C using the IPC-TM-650 method (unlimited number of times). And equipped with real-time resistance detection function. Used to detect cracking or separation of pore structures during high-temperature/expansion reflow soldering.
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