Using HATS2 ™ (Highly Accelerated Thermal Shock)2  Testing for Assembly Reflow Simulation, Accelerated Reliability and Robustness of Automotive PCB’s Using HATS2 ™ (High Acceleration Thermal Shock Generation II) Conduct reflow soldering, accelerated reliability, and robustness testing on PCBs The founder of this device is Mr. Bob Neves, who has extensive experience in the electronic circuit testing industry. Bob Neves is the founder and chairman/chief operating officer of Microtek Laboratories, a third-party testing organization with offices in Jiangsu, China and California, USA. He served as the President of IRTS, a manufacturer of the first generation HATS testing machines. Mr. Neves has served as the Chairman of the Board of Directors of the International Electronic Industry Connectivity Association (IPC). He was inducted into the IPC Hall of Fame - IPC's highest lifelong honor. He has been awarded the IPC Chair Award and the Dieter Bergman IPC Researcher Award in recognition of his long-term contributions to the electronics industry. Mr. Neves has served as the Chair of IPC TAEC, Chair of Printed Circuit Board General Committee, Chair of HDI General Committee, Chair of Printed Circuit Board Testing Methods Working Group, Chair of Laboratory Qualification (IPC-QL-653) Committee, and has participated in over 50 IPC technical committees throughout his career. He has served as the Chair of IEC TC91 Working Group 10 on Printed Circuit Testing Methods, and is also a member of the IEC T91 Working Group on Printed Circuit Boards and Copper Clad Plates. He once served as the president of the California Circuit Board Association. Mr. Neves has published dozens of articles and technical papers on reliability, testing, testing methods, and fault analysis, and is the author of the PCB acceptability section in the sixth edition of Combs' Printed Circuit Handbook. Mr. Neves has taught many courses on the basics of electronic system testing, reliability, and fault analysis. Ms. Laya Chen is also a member of the team that established Microtek Changzhou Laboratory, a third-party testing organization with a company in Jiangsu, China. She previously served as the Assistant Chairman and Training Manager of Microtek Changzhou Laboratory. She is a certified IPC-A-600 lead lecturer/trainer who has taught dozens of courses on printed circuit board (PCB) quality and acceptance. Laya previously served as the General Manager of Greater Asa Pacific, an equipment, trading, and technology company, and currently holds the position of HATS ² ™ General Manager of Reliability Assessment Solutions, a manufacturer of testing machines. Laya is proficient in both English and Chinese (various dialects), and has utilized this skill and her technical knowledge to translate a large number of technical articles, presentations, and IPC files in different languages. She has served as the Chair of the IPC 7-31a Committee and has participated in many IPC technical committees, receiving various committee service awards. Testing equipment used to evaluate the reliability, robustness, and component adhesion process survivability of through-hole structures The device can test IPC-2221B D samples HATS² ™ Single hole sample *, substrate&customized sample; Each sample can have up to 7 testing channels Each box can test 72 IPC D or 36 HATS ² ™ Single hole */customized sample Perform air method high and low temperature cycling test according to IPC-TM-650 method 2.6.7.2C Perform rapid high and low temperature cycling or reflow soldering simulation tests within the testing temperature range of -65 ° C to 265 ° C; The thermal shock cycle time has been reduced by 60% to 80% (approximately 1000 cycles can be tested per week) Conduct convection reflow soldering simulation test according to IPC-TM-650 method 2.6.27B - with real-time resistance monitoring function The system's built-in curve simulator can automatically simulate any reflow soldering curve Robustness testing of temperature cycling and reflow soldering simulation within the temperature range of -65 ° C to 265 ° C (unlimited number of times) Provide HATS globally ™ & HATS² ™ testing service Provide detailed test reports including box line diagrams