Highly Accelerated Thermal Shock

Using HATS2 ™ (Highly Accelerated Thermal Shock)2  Testing for Assembly Reflow Simulation, Accelerated Reliability and Robustness of Automotive PCB’s

Make HATS 2 (accelerated thermal shock II generation) reflow PCB, accelerate reliability and robustness test.

The founder of this equipment is Mr. Bob Neves, who has profound experience in the electronic circuit testing industry.

Bob Neves is the founder, chairman and chief operating officer of Microtek Lab, a third-party testing organization with companies in Jiangsu, China and California, USA. He was the president of IRTS, a manufacturer of the original HATS tester.

Mr. Neves was the Chairman of the Board of Directors of the International Electronic Industry Interconnection Association (IPC). He was elected to the IPC Hall of Fame -IPC's highest honor for life. He was awarded IPC Chairman Award and Dieter Bergman IPC Researcher Award in recognition of his long-term contribution to the electronics industry. Mr. Neves has served as Chairman of IPC TAEC, Chairman of General Committee of Printed Circuit Board, Chairman of General Committee of HDI, Chairman of Working Group on Test Methods of Printed Circuit Board and Chairman of Laboratory Qualification (IPC-QL-653) Committee, and has participated in more than 50 IPC technical committees during his career. He was the chairman of the 10th Working Group of IEC TC91, and a member of the IEC T91 Working Group on Printed Circuit Boards and Copper Clad Boards. He was the chairman of the California Circuit Board Association. Mr. Neves has published dozens of articles and technical papers on reliability, testing, testing methods and fault analysis, and is the author of PCB acceptability in the sixth edition of Combs Handbook of Printed Circuits. Mr. Neves has taught many courses on the basics of electronic system testing, reliability and fault analysis.

Ms Laya Chen is also a member of the team that established Microtek Changzhou Laboratory, which is a third-party testing organization with a company in Jiangsu, China. She served as assistant to the chairman and training manager of Microtek Changzhou Laboratory. She is a certified main lecturer/trainer of IPC-A-600, and has taught dozens of courses on PCB quality and acceptance. Laya used to be the general manager of Greater Asa Pacific, an equipment, trade and technology company, and is now the general manager of Reliability Assessment Solutions, a manufacturer of HATS²™ test machines. Laya is proficient in English and Chinese (various dialects), and has used this skill and her technical knowledge to translate a large number of technical articles, presentations and IPC files in different languages. She served as the chairman of IPC 7-31a Committee, participated in many IPC technical committees and won various committee service awards.

Test equipment for evaluating reliability and robustness of via structure and survivability of component attachment process

The equipment can test IPC-2221B D sample, HATS²™ single hole sample *, substrate & customized sample; Each sample has at most 7 test channels.

Each box can test 72 pieces of IPC D or 36 pieces of HATS²™ single hole */customized samples.

According to IPC-TM-650 method 2.6.7.2C, the high and low temperature cycle test of air method was carried out.

Perform rapid high-low temperature cycle or reflow simulation test within the test temperature range of-65 C to 265°C;

Thermal shock cycle time is reduced by 60% to 80% (about 1000 cycles can be tested every week)

According to IPC-TM-650 method 2.6.27B, the simulation test of convection reflow soldering-with real-time resistance monitoring function.

The system's own curve simulator can automatically simulate any reflow curve.

Robustness test of temperature cycling and reflow simulation in the temperature range of-65 C to 265°C (unlimited times)

Provide HATS™ & HATS²™ testing services around the world

Provide detailed test report including box diagram.

U.S. Patent No.10,379,153. German patent number 10 2019 006 553.0. Japanese Patent No.7,291,045. China patent number ZL 2019 2 2142627.1. Other patent numbers in the world are being updated.