Thermal deformation tester (TDM)

The Thermal Deformation Appearance Detector is a device developed and produced by the French company INSIDIX, designed to detect changes in the appearance of electronic components or circuit boards. It primarily utilizes the Moiré fringe principle. Through a side-facing projection device, Moiré fringes are projected onto the surface of the sample to be tested inside the oven. The camera above the sample captures the morphological changes on the sample surface. Finally, software is used to restore the 3D morphology and specific height data. Equipment brand: INSIDIX Equipment model: TDM Compact3 XL

1、 TDM equipment model

Introduction to Thermal Shape Tester Models

• Temperature measurement range -65 degrees Celsius to 400 degrees Celsius

Using OCT mode to project moir é patterns can obtain three-dimensional information of the sample surface

• Thermal expansion coefficient measurement function

• Multi lens group switching

The sample size measurement range is from 1 × 1 mm to 600 × 600 mm

The optimal resolution is below 1 micron

New type of 3D measurement sensor

Using OCT mode to project moir é patterns can obtain three-dimensional information of the sample surface

• Multi lens group switching

The sample size ranges from 1 × 1 mm to 1000 × 1000 mm

The optimal resolution is below 1 micron

Tabletop Thermal Shape Tester

Compact 2- Thermal Shape Tester

Compact 3- Thermal Shape Tester

2.Functional requirements for equipment

2.1 The main purpose of the equipment is to measure the thermal compatibility between printed boards (substrates) and components at different temperatures such as room temperature, high temperature, and low temperature. Realize the detection of warpage of substrates and components, and measure the changes in warpage of the tested object with temperature changes (simulating the temperature changes of reflow soldering) to ensure the matching degree between the substrate and components, guarantee the welding quality and reliability of the product.

2. 2 Measurement principle of thermal deformation testing system: using Projection Moir é and other testing methods that meet the international standard JEDEC JESD22-B112A.

2.3  Product composition: The equipment mainly consists of a heating device, a working chamber, a projection device, a camera device, a control and data processing computer, and data processing software.

3 Scope of application of the equipment

This device is widely used in the semiconductor industry, PCB circuit board and other industries. Can be compatible with testing of many products, such as CSP, BGA, Strip, PCB, Wafer, WLP, PCBA, Socket, Modules, etc